AK-455 is a silicone-based thermal compound designed to improve heat transfer between a CPU/GPU and a heatsink. It’s easy to apply and comes in a 1.5 g syringe.

Up to 2.4 W/m·K (manufacturer spec).

Operating temperature is –50 °C to +240 °C.

No — Akasa lists it as non-curing, so performance is stable without a long cure period.

It’s a silicone (non-metal) compound. Silicone pastes are generally non-electrically conductive and non-capacitive, reducing risk if a little spreads beyond the die. (Avoid direct contact with sockets/pins as best practice.)

This listing is 1.5 g. Typical use is ~0.1–0.2 g per desktop CPU application (varies by heat-spreader size), so roughly 7–12 applications as a ballpark.

Yes — AK-455 is suitable for Intel & AMD CPUs and GPUs with conventional heatsinks. Clean both surfaces with isopropyl alcohol before applying.

Use a small pea-sized dot (or thin line for rectangular dies) in the center of the heat-spreader, then mount the cooler with even pressure so the paste spreads to a thin, uniform layer.

Not usually. Re-apply when you change coolers, remove the heatsink, or after several years if temperatures creep up due to pump-out or dust buildup.

No. It’s a non-adhesive thermal interface — remove by gently twisting the cooler after warming the system, then clean both sides and re-apply fresh paste.

Yes, provided you can access the heatsink. Use even less compound for smaller dies to avoid squeeze-out.

Cap the syringe tightly, store at room temperature, upright if possible. If separated slightly over long storage, gently knead the syringe before use.

• Thermal conductivity: 2.4 W/m·K
• Operating temp: –50 °C to +240 °C
• Type: Silicone-based, non-curing
• Volume/weight: 1.5 g syringe

Liquid metal can conduct heat better but is electrically conductive and can damage aluminium heatsinks. AK-455 is safer and simpler, ideal for everyday PC builds and maintenance.